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Rogers CuClad 233 DK2.33 Df0.0013 (Various Thickness) PTFE PCB Board Material
Brief Introduction
The CuClad series from Rogers Corporation is a line of PTFE/Woven Fiberglass laminates designed as microwave printed circuit board substrates. CuClad 233 features a medium fiberglass/PTFE ratio, balancing a low dielectric constant and improved dissipation factor without sacrificing mechanical properties. It provides true electrical and mechanical isotropy in the XY plane, a unique feature critical for applications like phased array antennas.
Technical Features & Benefits
Cross-Plied Woven Fiberglass: Alternating plies oriented 90° to each other for true isotropy in the X-Y plane.
High PTFE to Glass Ratio: Enables excellent electrical performance.
Better Dielectric Constant Uniformity: Superior to comparable non-woven fiberglass reinforced laminates.
Electrical and Mechanical Isotropy in the X-Y Plane: Critical for sensitive circuit designs.
Extremely Low Loss: Ensures high signal integrity.
Well Suited for Er (Dielectric Constant) Sensitive Circuits.
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Typical Properties: CuClad 233
| Property |
Test Method |
Condition |
CuClad 233 |
| Electrical Properties | | | |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.33 |
| Dielectric Constant @1 MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.33 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0013 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted | -10°C to +140°C | -161 |
| Volume Resistivity (MΩ·cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 8.0 x 10⁸ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.4 x 10⁶ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Mechanical Properties | | | |
| Peel Strength (lbs/inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 510, 414 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 10.3, 9.8 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 276 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 371 |
| Physical & Thermal Properties | | | |
| Specific Gravity (g/cm³) | ASTM D-792 Method A | A, 23°C | 2.26 |
| Water Absorption (%) | MIL-S-13949H 3.7.7 / IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.02 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24 / Mettler 3000 TMA | 0°C to 100°C | X Axis: 23
Y Axis: 24
Z Axis: 194 |
| Thermal Conductivity | ASTM E-1225 | 100°C | 0.26 |
| Outgassing (Total Mass Loss %) | NASA SP-R-0022A | 125°C, ≤ 10⁻⁶ torr | 0.01 |
| Flammability | UL 94 Vertical Burn / IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
Application Areas
Military Electronics (Radars, ECM, ESM)
Microwave Components (LNAs, filters, couplers, etc.)
Phased Array Antennas
Other high-frequency applications requiring electrical/mechanical isotropy and low loss.
Available Configurations
Cladding: Typically supplied with ½ oz, 1 oz, or 2 oz electrodeposited copper on both sides. Other copper weights and rolled copper foil are available.
Bonded to Metal Ground Plane: CuClad can be bonded to aluminum, brass, or copper plates for integrated heat sinking and mechanical support.
Master Sheet Sizes:
36" x 36" (cross-piled configuration)
36" x 48" (parallel-piled configuration)
Special Consideration: For critical performance applications, an "LX" testing grade can be specified, where each sheet is individually tested with a report provided (at a higher price).
When ordering, specify dielectric constant, thickness, cladding, panel size, and any special requirements.
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